Higher Education Internationalization: A Peruvian University Experience

Ana Luna; Mario Chong; Djordje Djurica

doi:10.1109/edunine57531.2023.10102851

Higher Education Internationalization: A Peruvian University Experience

Ana Luna
, Mario Chong
, Djordje Djurica

Data, Process and Knowledge Management (Sabou)

Publikation: Beitrag in Buch/Konferenzband › Beitrag in Konferenzband

Originalsprache	Englisch
Titel des Sammelwerks	EDUNINE 2023: 7th IEEE World Engineering Education Conference
Untertitel des Sammelwerks	Reimaging Engineering - Toward the Next Generation of Engineering Education, Merging Technologies in a Connected World, Proceedings
Herausgeber*innen	Claudio da Rocha Brito, Melany M. Ciampi
Erscheinungsort	New Jersey
Verlag	IEEE
Seitenumfang	6
ISBN (elektronisch)	979-8-3503-2050-3
ISBN (Print)	979-8-3503-2051-0
DOIs	https://doi.org/10.1109/edunine57531.2023.10102851
Publikationsstatus	Veröffentlicht - 12 März 2023

Zugriff auf Dokument

10.1109/edunine57531.2023.10102851

Andere Dateien und Links

http://dx.doi.org/10.1109/edunine57531.2023.10102851

Zitat

Luna, A., Chong, M., & Djurica, D. (2023). Higher Education Internationalization: A Peruvian University Experience. in C. da Rocha Brito, & M. M. Ciampi (Hrsg.), EDUNINE 2023: 7th IEEE World Engineering Education Conference: Reimaging Engineering - Toward the Next Generation of Engineering Education, Merging Technologies in a Connected World, Proceedings IEEE. https://doi.org/10.1109/edunine57531.2023.10102851

Luna, Ana ; Chong, Mario ; Djurica, Djordje. / Higher Education Internationalization: A Peruvian University Experience. EDUNINE 2023: 7th IEEE World Engineering Education Conference: Reimaging Engineering - Toward the Next Generation of Engineering Education, Merging Technologies in a Connected World, Proceedings. Hrsg. / Claudio da Rocha Brito ; Melany M. Ciampi. New Jersey : IEEE, 2023.

@inproceedings{0ec5f8c639214b99bb1110f25b25f772,

title = "Higher Education Internationalization: A Peruvian University Experience",

author = "Ana Luna and Mario Chong and Djordje Djurica",

year = "2023",

month = mar,

day = "12",

doi = "10.1109/edunine57531.2023.10102851",

language = "English",

isbn = "979-8-3503-2051-0",

editor = "\{da Rocha Brito\}, Claudio and \{M. Ciampi\}, Melany",

booktitle = "EDUNINE 2023: 7th IEEE World Engineering Education Conference",

publisher = "IEEE",

}

Luna, A, Chong, M & Djurica, D 2023, Higher Education Internationalization: A Peruvian University Experience. in C da Rocha Brito & M M. Ciampi (Hrsg.), EDUNINE 2023: 7th IEEE World Engineering Education Conference: Reimaging Engineering - Toward the Next Generation of Engineering Education, Merging Technologies in a Connected World, Proceedings. IEEE, New Jersey. https://doi.org/10.1109/edunine57531.2023.10102851

Higher Education Internationalization: A Peruvian University Experience. / Luna, Ana; Chong, Mario; Djurica, Djordje.
EDUNINE 2023: 7th IEEE World Engineering Education Conference: Reimaging Engineering - Toward the Next Generation of Engineering Education, Merging Technologies in a Connected World, Proceedings. Hrsg. / Claudio da Rocha Brito; Melany M. Ciampi. New Jersey: IEEE, 2023.

Publikation: Beitrag in Buch/Konferenzband › Beitrag in Konferenzband

TY - GEN

T1 - Higher Education Internationalization: A Peruvian University Experience

AU - Luna, Ana

AU - Chong, Mario

AU - Djurica, Djordje

PY - 2023/3/12

Y1 - 2023/3/12

UR - http://dx.doi.org/10.1109/edunine57531.2023.10102851

U2 - 10.1109/edunine57531.2023.10102851

DO - 10.1109/edunine57531.2023.10102851

M3 - Contribution to conference proceedings

SN - 979-8-3503-2051-0

BT - EDUNINE 2023: 7th IEEE World Engineering Education Conference

A2 - da Rocha Brito, Claudio

A2 - M. Ciampi, Melany

PB - IEEE

CY - New Jersey

ER -

Luna A, Chong M, Djurica D. Higher Education Internationalization: A Peruvian University Experience. in da Rocha Brito C, M. Ciampi M, Hrsg., EDUNINE 2023: 7th IEEE World Engineering Education Conference: Reimaging Engineering - Toward the Next Generation of Engineering Education, Merging Technologies in a Connected World, Proceedings. New Jersey: IEEE. 2023 doi: 10.1109/edunine57531.2023.10102851